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Automated Measurement System aids image sensor manufacturing.

2013-07-11 14:30:11| Industrial Newsroom - All News for Today

Featuring seamless software integration with GEMINI® FB fusion wafer bonding system, EVG®40NT supports manufacture of 3D-integrated CMOS image sensors. Automated system performs non-destructive, top-to-bottom side alignment accuracy measurements on double-sided structured wafers or bond interfaces as well as critical dimension and box-in-box measurements of single- and double-sided structured wafers. Wafer-to-wafer alignment accuracy is measured to within 40 nm (3 sigma). This story is related to the following:Quality Control Measurement Systems |

Tags: system image manufacturing aids

 

Digital Image Analysis Software inspects IC components.

2013-07-11 14:30:11| Industrial Newsroom - All News for Today

Available on all Sonoscan equipment, Digital Image Analysis Toolbox™ automates acoustic analysis of individual IC components and various types of bonded wafers. Product sorts components automatically into accept/reject or multiple defined categories. It contains many pre-defined common analysis tools such as interface analysis, wafer bond analysis, and chip on wafer analysis. Because placement of component can be imperfect, DIA Toolbox provides search and locate function. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Imaging Software | Wafer Inspection Systems

Tags: software image digital analysis

 
 

Apple prepping IGZO displays for next-gen iPad to cut power consumption, boost image quality

2013-07-10 19:08:38| Extremetech

Apple is reportedly adopting Sharp's new IGZO technology for its high-resolution displays. The new displays would consumer considerably less power than current models, though production costs are rumored to be significantly higher.

Tags: image power quality cut

 

Image Analysis Software runs on Windows 8.

2013-07-08 14:29:29| Industrial Newsroom - All News for Today

With ImageUV™, users of UV-visible-NIR range microscopes and microspectrophotometers can acquire and analyze images in UV, color, and NIR regions with single software package. Windows™ 8 optimizes usability of software with such features as native touchscreen control, quick resizing of windows, and accelerated access to often used documents and spectra. In addition, Windows™ Search enables engineers and scientists to quickly locate and analyze data. This story is related to the following:Optics and PhotonicsSensors, Monitors and TransducersSearch for suppliers of: Image Processing Software | Image Analysis Microscopes |

Tags: software image windows analysis

 

Inspection Camera solves angled image acquisition problems.

2013-07-05 14:30:54| Industrial Newsroom - All News for Today

Suited for machine vision systems, color/monochome Super Focusing Camera comes in versions with 2M (2048 x 1088) and 5M (2048 x 2056) pixel counts featuring respective frame rates of 70 and 16 fps and dimensions of 68 x 68 x 54 mm and 68 x 68 x 83 mm. Angled image acquisition enables inspection on multiple sides simultaneously; connector pins can be seen without overlap, so one image acquisition is enough for entire inspection. Camera does not have to be installed directly above target. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Machine Vision Cameras

Tags: image problems camera inspection

 

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