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IREC Releases Update to Highly Influential Interconnection Model Procedures
2013-04-23 06:00:00| Industrial Newsroom - All News for Today
IREC update to Model Interconnection Procedures addresses Pre-Application Report for developers, use of location-specific criteria during interconnections, establishing timeframes for technical criteria during Supplemental Review Process, and electronic signatures. Update also includes footnotes with key provisions and information on state alternatives. Procedures specify technical requirements, timeframes, fees, and review process for connecting renewable energy systems to utility grid. This story is related to the following:Green & CleanSearch for suppliers of:
Tags: model
update
highly
releases
NFPA Releases Updated Pre-Competitive Research Agenda for the Fluid Power Industry
2013-04-23 06:00:00| Industrial Newsroom - All News for Today
Update to NFPA's 2009 Technology Roadmap for the Fluid Power Industry revisits 6 broad areas of Research Challenge. Pre-competitive research, market education, and standardization initiatives aligned with all 6 Challenges comprise agenda that can be used by organizations to pursue projects of importance to fluid power industry. NFPA intends to use this updated agenda to continue shaping and directing research efforts of NFPA Education and Technology Foundation and CCEFP. This story is related to the following:Green & CleanSearch for suppliers of:
Tags: power
research
updated
industry
Send Press Releases with GlobeNewswire
2013-04-23 05:21:36| Auto Parts - Topix.net
The dynamism reflected in a series of newly-developed Internet delivery products from COMPS InfoSystems, Inc., the nation's leading commercial real estate information service, continues to unfold with the introduction of its Pipeline search engine at a demonstration event today in Denver, Colorado before a select group of key industry ... (more)
Tags: send
press
releases
press releases
Nordic Semiconductor Releases World's Smallest Bluetooth Low Energy And ANT+ ICs To Target The Most Space-Constrained Wireless Accessories And Devices
2013-04-23 03:44:46| rfglobalnet News Articles
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the immediate availability of two wafer-level chip-scale package (WLCSP) variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs (System-on-Chips) that will now join the company's class-leading nRF51 Series.
Tags: low
accessories
energy
target
Nordic Semiconductor Releases World's Smallest Bluetooth Low Energy And ANT+ ICs To Target The Most Space-Constrained Wireless Accessories And Devices
2013-04-23 03:44:46| wirelessdesignonline News Articles
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the immediate availability of two wafer-level chip-scale package (WLCSP) variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs (System-on-Chips) that will now join the company's class-leading nRF51 Series.
Tags: low
accessories
energy
target
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