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Tag: bonding
Wafer Bonding Systems support wafers up to 200 mm in diameter.
2015-03-24 13:31:07| Industrial Newsroom - All News for Today
Designed for universities and R&D groups, EVG®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm robot to support up to 6 process modules for max throughput. Both operate in high-vacuum-process environment.
Tags: support
systems
diameter
bonding
Bonding & Grounding Communications Circuits
2015-03-12 14:21:00| Electrical Construction & Maintenance
Article 800 covers communications circuits and equipment. read more
Tags: communications
circuits
bonding
grounding
Novelis and Henkel partner on advanced bonding technology for high-volume aluminum vehicles
2015-03-05 16:55:29| Green Car Congress
Tags: advanced
technology
partner
vehicles
Is This a Bonding Jumper?
2015-02-25 13:00:00| Electrical Construction & Maintenance
Article 250 covers the general requirements for bonding and grounding electrical installations. read more
02.18.15 -- Dow Supplies Aluminum Bonding Adhesives For Ford F-150
2015-02-16 04:47:43| chemicalonline News Articles
02/18/15Chemical Online Newsletter
Tags: supplies
ford
aluminum
dow
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