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3D Inspection System is capable of sintering paste evaluation.

2014-07-16 14:30:32| Industrial Newsroom - All News for Today

With hardware and software adaptions, SPI-LINE 3D electronic solder paste inspection system handles inspection of printed sintering paste in electronic assemblies manufacturing. High-speed 3D camera head can capture thin sintering paste layers with precision, while integrated algorithms enable evaluation of sintered paste printing in addition to accurate and rapid measurement of height, volume, and offset of applied sintering paste. UI also facilitates test program generation. This story is related to the following:Test and Measuring Instruments Sponsored by: Red Lion Controls - UntitledSearch for suppliers of: Inspection Systems

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