Home AGC And nMode Solutions Launch Subsidiary Triton Micro Technologies To Develop Novel Via-Fill Technology For Advanced Semiconductor Packaging
 

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AGC And nMode Solutions Launch Subsidiary Triton Micro Technologies To Develop Novel Via-Fill Technology For Advanced Semiconductor Packaging

2013-03-13 02:27:44| wirelessdesignonline News Articles

Leveraging synergies in their respective technologies, Tokyo-based Asahi Glass Co., Ltd. (AGC) and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1M to co-found a subsidiary business,Triton Micro Technologies, to develop innovative via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

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