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AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

2013-04-08 06:00:00| Industrial Newsroom - All News for Today

CRANSTON, RI - April 8, 2013 - AIM Solder, a global leader in the manufacture of solder assembly materials for the electronics industry, will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.<br /> <br /> This low-cost, lead-free and halogen-free solder paste offers the performance of tin/lead and high-silver, lead-free solder pastes. Now manufacturers can attain the ...This story is related to the following:Lead-Free Solder | Solder | Soldering Flux | Lead-Free Alloys |

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