Completely automated and convertible to perform full laboratory analysis, Model DF2400™ offers SECS-II/GEM E30 and SMEMA compatibility and is suited for inspecting ICs and flip chips in JEDEC-style trays or metal carriers as well as lead frame strips, IGBT power modules, and other components. Throughput is optimized due to two transducers and two simultaneous scanning stages. Dedicated drying areas permit new carriers to be scanned immediately on completion of previous scan.
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