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Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series
2013-02-13 12:26:28| electronicsweb Downloads
The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.
Tags: series
heat
stick
aluminum
Category:Electronics and Electrical
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