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AdvancedMC Module supports wireless processing applications.

2014-01-27 14:31:31| Industrial Newsroom - All News for Today

Featuring processing power of Xilinx Virtex®-7 FPGA and two TI TMS320C6670 multicore DSPs, Model AMC-V7-2C6670 is designed for wireless processing applications, including 4G, LTE, LTE Advanced, and beyond. Device includes up to 2 GB of 64-bit wide DDR3-1600 SDRAM for each DSP, as well as Serial RapidIO, Gigabit Ethernet, and PCI Express for maximum I/O flexibility. Full-size, single width PICMG AMC.0 R2.0 AMC is suitable for use in both ATCA carriers and MicroTCA chassis. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: I/O Modules

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