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Agilent Technologies Announces Advanced Modeling Solutions For Nanoscale 3D FinFETs And High-Frequency/High-Power GaN HEMTs

2014-06-20 12:52:06| rfglobalnet Home Page

Agilent Technologies Inc. recently announced several innovations for the 2014 release of its industry-leading suite of device modeling and characterization software tools. The suite comprises Agilent EEsof EDA'sIntegrated Circuits Characterization and Analysis Program (IC-CAP),Model Builder Program (MBP),andModel Quality Assurance (MQA).

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