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Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging...

2015-04-07 09:50:28| Wireless - Topix.net

This approach results in an extremely thin package height of less than 0.5mm that is ideal for applications where space is at a premium, such as sensor applications, small form-factor industrial equipment, and portable electronics. Other benefits include a better than 200 percent improvement in board-level reliability compared to standard WLCSP, while enabling a large die size envelope and high package I/O count, targeting applications such as wireless LAN and power management ICs .

Tags: packaging altera innovate tsmc

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