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Amkor Technology Takes Leadership Position In Advanced System-In-Package Market
2016-03-29 07:19:31| rfglobalnet Home Page
Amkor Technology Inc., a leading semiconductor packaging and test service provider, recently announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications. This achievement establishes Amkor’s leadership in delivering low-cost, high-performance advanced SiP solutions.
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Category:Telecommunications
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