Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, Model SG-BGA-6412 is designed for 31 x 31 mm Hybrid Memory Cube with 1 mm pitch and 900-pin BGA. Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB with no soldering, socket features contact resistance of 20 mΩ per pin, current capacity of 2 A per pin, and temperature range of -35 to +100°C.