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BGA Socket accommodates hybrid memory cube.

2014-12-15 14:32:34| Industrial Newsroom - All News for Today

Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, Model SG-BGA-6412 is designed for 31 x 31 mm Hybrid Memory Cube with 1 mm pitch and 900-pin BGA. Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB with no soldering, socket features contact resistance of 20 mΩ per pin, current capacity of 2 A per pin, and temperature range of -35 to +100°C.

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