Designed for 1 mm pitch 1521 ball BGA, SG-BGA-8030 operates at bandwidths up to 10 GHz with less than 1 dB insertion loss. Contact resistance is 20 mΩ per I/O (typ). Mounted using supplied hardware on target PCB without any soldering, product incorporates heat sink and fan to dissipate 60 W. Integrated compression mechanism to socket lid facilitates BGA change, and package sizes accommodated by socket are 1mm pitch 40 x 40 mm, 39 x 39 ball array.
This story is related to the following:Ball Grid Array (BGA) Sockets |