Taking place November 19–20, IPC Southeast Asia Conference on Solder and Reliability will host experts from Asia, Europe, and North America presenting strategies for enhancing reliability in electronics assemblies. Full-day technical conference on November 20, opening with keynote presentation on qualification, will be preceded by full-day workshop on leveraging chip-on-board technology. Other presentations address strategic reliability related to solder alloys and packaging ...This story is related to the following:Trade Associations