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Boundary Scan Module facilitates DDR3-DIMM socket testing.

2014-07-01 14:31:10| Industrial Newsroom - All News for Today

Once plugged into test socket, CION Module SO-DIMM204-3/ECC allows structural test coverage of DDR3 memory interfaces. All signal pins, as well as almost all Ground-Pins, can be tested via Boundary Scan. Equipped with CION™ Boundary Scan ASIC, module can be connected to any Test Access Point (TAP) and lets user detect link failures. Tests take fractions of seconds, and even parallel testing of multiple memory interfaces is possible. This story is related to the following:Testing Instruments |

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Category:Industrial Goods and Services

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