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Home › Cadence Announces Availability Of Complete IC Packaging Design And Analysis Solutions For Advanced Fan-Out Wafer-Level Chip Scale Packaging

 

Cadence Announces Availability Of Complete IC Packaging Design And Analysis Solutions For Advanced Fan-Out Wafer-Level Chip Scale Packaging

2016-03-15 08:53:45| wirelessdesignonline News Articles

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the industry's only foundry-proven IC packaging design and analysis solutions for advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.

Tags: advanced design complete analysis

Category:Telecommunications

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