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Chipset Updates: QUALCOMM, Inc. (QCOM)'s Patent, Intel Corporation...

2013-09-14 10:44:13| Semiconductors - Topix.net

Qualcomm Assigned Patent for Distributed Building Blocks of R-C Clamping Circuitry in Semiconductor Die Core Area QUALCOMM, Inc. , San Diego, has been assigned a patent developed by four co-inventors for a "distributed building blocks of R-C clamping circuitry in semiconductor die core area."

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