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Compal Communications Selects Broadcom® Dual-Core 3G Turnkey Platform for Android ...

2013-04-02 06:00:00| Industrial Newsroom - All News for Today

Enables Leading Taiwanese ODM to Accelerate Smartphone Production<br /> <br /> IRVINE, Calif.<br /> <br /> News Highlights:<br /> <br /> &bull; Broadcom's complete turnkey solution expedites production and lowers costs of 3G smartphones<br /> &bull; New Android smartphones from Compal feature a dual-core HSPA+ processor, VideoCore® multimedia and an advanced connectivity suite for unsurpassed performance at an affordable price point<br /> &bull; Compal expects new smartphones with Broadcom's ...This story is related to the following:Computer Hardware and PeripheralsSearch for suppliers of: Cellular Telephone Software |

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