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Conductive Adhesive suits die attach applications.
2013-10-29 13:29:35| Industrial Newsroom - All News for Today
Designed for chip-on-board or general die attach applications in circuit assembly, photonics, or camera modules, CA-165 is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement, and conductive adhesive features both moderate glass transition temperature (Tg) and modulus.<br /> <br /> This story is related to the following:Die Attached Adhesives |
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Category:Industrial Goods and Services