Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces.
This story is related to the following:Electrically Conductive Adhesives