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Home › Conductive Adhesive targets die-attach applications.

 

Conductive Adhesive targets die-attach applications.

2014-02-19 14:30:32| Industrial Newsroom - All News for Today

Able to cure in 30 minutes at 80°C or in seconds at 200°C, CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive has optimized rheology for needle dispensing by time-pressure, auger, or positive displacement. After curing for 30 minutes at 80°C, electrical conductivity is 0.00006 Ω-cm. Product is suited for die-attach applications in smart cards, circuit assembly, photonics, and camera modules. This story is related to the following:Health, Medical and Dental Supplies and EquipmentSearch for suppliers of: Die Attached Adhesives | Adhesives |

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