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Custom Thin Film Substrate support sidewall patterning.

2015-03-04 14:31:09| Industrial Newsroom - All News for Today

Increasing design flexibility and density for equipment miniaturization, SDWP substrates accommodate die attach or wire bonding on side walls as well as top side. This lets designers provide continuity between top and bottom of die, connect wire bonds to traces on side of die, or make contact with side of die with pin. SDWP substrates feature plate thickness of ≤0.025 in., min line width and gap of ≥0.003 in., and tight line width and gap tolerances down to ±0.001 in.

Tags: support film custom thin

Category:Industrial Goods and Services

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