Able to socket 8 x 14 mm, 7.5 x 13 mm, 9 x 13 mm, and 9 x 16 mm ICs with BGA package on any PCB without any soldering, SG-BGA-6410 operates at bandwidths up to 8 GHz with less than 1dB insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Footprint adds 2.5 mm on each side, and construction includes shoulder screw and swivel lid. Latter incorporates quick insertion method to accelerate IC changeout.
This story is related to the following:Printed Circuit Sockets | Ball Grid Array (BGA) Sockets