Designed for attaching semiconductor die in temperature-sensitive devices, 561-50 Low Temperature Cure Adhesive is suited for smart cards, camera modules, and flex circuits. Electrically conductive product is more than 90% cured after 30 min at 80°C, but has dispensing work life greater than 48 hr, while maintaining optimized rheology for dispensing, damp heat resistance, and conductivity stability. Also, flexible material can be fast cured in 1 min at 180°C.
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