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Die-Singulation System features plasma-based operation.

2013-09-30 14:30:14| Industrial Newsroom - All News for Today

Utilizing energized plasma, MicroDieSingulator (MDS)-100 systems deliver singulation of semiconductor dies from 4, 6, and 8 in. wafers mounted on industry-standard tape frames. Singulation (dicing) of individual dies can be achieved with separation lines (streets) of 20 microns or less, maximizing utilization of silicon-wafer real-estate. Also, MDS technology separates dies without causing lateral damage from stress-induced cracking, overheating, or re-deposition of ablated material. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesSearch for suppliers of: Wafer Dicing & Slicing Systems | Slicing & Wafering Machinery |

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