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Dow Corning Takes Prestigious 3D InCites Award for Its Advanced New Temporary Bonding Solution ...
Dow Corning Takes Prestigious 3D InCites Award for Its Advanced New Temporary Bonding Solution ...
2013-07-17 06:00:00| Industrial Newsroom - All News for Today
MIDLAND, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it has won a prestigious 3D InCites Award for its innovative new Temporary Bonding Solution for 2.5D and 3D IC packaging applications. Winning the Materials category, Dow Corning accepted the award at a well-attended, invitation-only ceremony held during last week's SEMICON West 2013 in San Francisco.<br /> <br /> 3D InCites, an online media resource promoting news, ...This story is related to the following:Bonding Agents |
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Category:Industrial Goods and Services
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