Home Dow Corning and imec to Develop Technologies for 3-D IC Semiconductor Packaging
 

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Dow Corning and imec to Develop Technologies for 3-D IC Semiconductor Packaging

2013-07-10 06:00:00| Chemical Processing

Dow Corning said July 8 it has joined nano-electronics research center imec to develop 3-D integrated circuit (IC) packaging technologies.

Tags: develop technologies packaging ic

Category:Chemicals

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