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Dow Corning boards Imec's 3D IC packaging initiative

2013-07-09 19:01:34| Chemicals - Topix.net

Dow Corning has joined the growing community of companies participating in advanced research on the development and broader adoption of 3D integrated circuit packaging technologies, spearheaded by technology promises to reduce form factor and power consumption, and increase bandwidth to enable more efficient inter-chip communication for ... (more)

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