Optimized for hot roll lamination and processing on micro electro mechanical systems (MEMS) and IC wafers, DF-3020 comes in thickness formats from 5–50 µm, ±5%. Cured chemistry can withstand harsh environments, including extreme moisture and corrosive chemicals; glass transition temperature is 158°C; and moderate modulus is 3.5 GPa at 25°C. Suited for MEMS and wafer-level packaging applications (TSV sealing), hydrophobic product can be used in contact with EMS spin coatable photoresists.