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Home › Dry Film Negative Photoresists withstand harsh environments.

 

Dry Film Negative Photoresists withstand harsh environments.

2013-10-15 14:31:32| Industrial Newsroom - All News for Today

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-2000 Series is available in thickness formats from 5–50 µm ±5%. Films feature glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand harsh environments, including extreme moisture conditions and corrosive chemicals. Films are compatible with and can be used in contact with EMS line of spin coatable photoresists. This story is related to the following:Photoresists

Tags: film negative dry environments

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