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DuPont Circuit & Packaging Materials And IQLP Ink Deal To Develop High-Speed Circuit Technology

2013-08-13 05:51:36| rfglobalnet Home Page

DuPont Circuit & Packaging Materials (DuPont) and IQLP, LLC, a division of Interplex Industries, Inc., recently announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.

Tags: technology deal develop materials

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