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ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System

2016-03-25 11:31:10| Industrial Newsroom - All News for Today

ESIs CornerStone ICP platform will facilitate the centers ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for...

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