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"ESiP" Creates Reliable System-in-Package Demonstrators and...
2013-11-27 21:35:40| Semiconductors - Topix.net
The ENIAC Joint Undertaking announced that the project "Efficient silicon multi-chip System-in-Package integration - reliability, failure analysis and test " received the 2013 Innovation Award for demonstrating high quality and reliability for applications from consumer to aeronautics.
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Category:Electronics and Electrical
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