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ETX Module fosters targeted carrier board design via flexibility.

2015-12-30 14:31:04| Industrial Newsroom - All News for Today

Powered by 1.91 GHz quad-core Intel® Atom™ E3845 CPU SoC, 95 x 114 mm ET839 operates from -40 to +85°C and offers scalable performance that allows replacement/upgrade of Bay Trail-I ETX solutions without changing baseboard. Module supports up to 4 GB DDR3L SO-DIMM system memory and offers diverse I/O options. Integrated graphics enable dual independent displays via 24-bit dual channel LVDS and CRT graphics outputs with respective resolutions up to 1,600 x 1,200 and 2,048 x 1,536.

Tags: design board module carrier

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