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Epoxy Adhesive suits microelectronic assembly applications.

2014-01-14 14:30:45| Industrial Newsroom - All News for Today

Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. This story is related to the following:Epoxy Adhesives

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