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Epoxy Potting Compound suits applications to 365°F.

2015-03-27 13:31:09| Industrial Newsroom - All News for Today

Offering thermal conductivity, electrical insulation, and low shrinkage after cure, Aremco-Bond™ 2315 is suited for potting and encapsulating densely packaged power supplies, rectifiers, ICs, oscillators, DACs, amplifiers, and relays. Black-pigmented product provides flexural strength of 12,300 psi and dielectric strength of 480 V/mil. Mixed in ratio of 100 parts resin to 25 parts hardener by weight, compound cures in 2 hr at 160°F plus 2 hr at 300°F.

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Category:Industrial Goods and Services

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