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Home › Essemtec to Present Innovations at SMT Hybrid Packaging 2015

 

Essemtec to Present Innovations at SMT Hybrid Packaging 2015

2015-03-13 11:31:12| Industrial Newsroom - All News for Today

Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion...

Tags: present packaging hybrid innovations

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