Home › Essemtec to Present Innovations at SMT Hybrid Packaging 2015
 

Keywords :   


Essemtec to Present Innovations at SMT Hybrid Packaging 2015

2015-03-13 11:31:12| Industrial Newsroom - All News for Today

Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion...

Tags: present packaging hybrid innovations

Category:Industrial Goods and Services

Latest from this category

All news
01.10Boosting Membership Value
Industrial Goods and Services »
06.10'Rightmove is my porn' - the addiction to online property search
06.10Eastern North Pacific Tropical Weather Outlook
06.10Atlantic Tropical Weather Outlook
05.10Tropical Storm Milton Public Advisory Number 2
05.10Hurricane Kirk Graphics
05.10Hurricane Kirk Forecast Discussion Number 26
05.10Tropical Storm Milton Graphics
05.10Hurricane Kirk Wind Speed Probabilities Number 26
More »