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Excimer Laser Stepper creates vias and microstructures.

2014-02-26 14:30:44| Industrial Newsroom - All News for Today

Configured for handling 200 mm and 300 mm wafers, ELP300 Gen2 meets technology driven requirements of advanced packaging and 3D industry. Product provides means to directly create <5 µm vias and microstructures, addressing limitations of traditional photo-dielectrics and photolithography steppers. With Excimer laser ablation, alternative organic polymers can be used, which contain optimized mechanical, physical, thermal, and chemical properties to lower cure temperatures and CTE stresses. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - Tile AdSearch for suppliers of: Wafer Processing Systems

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