Ensuring printed line height uniformity, Fine Line Stencil™ enables sub-40 µm line widths with no increase in line resistance. When used in dual print process, stencil first prints busbars with fine mesh screen, and then separately prints conductors. This allows optimized paste to be used for each process which not only gives precise control over print height of busbars and fine lines, thereby saving silver, but also allows non-contacting busbar paste to increase Voc and therefore cell efficiency.
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