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Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.

2014-07-08 14:31:19| Industrial Newsroom - All News for Today

GEMINI®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer cleaning and surface preparation, plasma activation, and wafer bond alignment. This story is related to the following:Materials and Material ProcessingSearch for suppliers of: Bonding Machinery

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