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Gap Filler exhibits low thermal resistance.

2015-11-24 14:31:06| Industrial Newsroom - All News for Today

Available in sheets from 0.3–3.0 mm thick, Sarcon® GR80A can be die-cut to fit almost any application shape. Silicone-based material completely fills air gaps between uneven components, board protrusions, and recessed areas while exhibiting very low pressure. When placed between heat source such as semiconductor and nearby heat sink, thermal interface material provides thermal conductivity of 13.0 W/m°K per ASTM D5470 and thermal resistance as low as 0.50°C cm²/W.

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