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Halogen- and Pb-Free Solder Paste improves ICT first-pass yields.

2015-03-02 14:31:06| Industrial Newsroom - All News for Today

Formulated to accommodate processing temperatures required by SnAgCu, SnAg, and other alloy systems used by electronics industry, Indium10.5HF no-clean solder paste conserves time and increases output for companies that require ICT as part of their normal production. Soft, pliable, non-tacky residue minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields, while stencil print transfer efficiency suits diverse processes.

Tags: paste yields improves ict

Category:Industrial Goods and Services

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