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High-Resolution Camera Module has low-profile design.

2013-04-10 14:28:19| Industrial Newsroom - All News for Today

Targeting next-generation, ultra-thin smartphones and tablet devices, TCM9930MD uses flip-chip structure for image sensor. Integrated image pre-processing LSI (companion) chip provides distortion correction and performs image resolution reconstruction, resulting in CMOS image sensor camera module with 13 MP imaging capabilities and 4.7 mm profile. This story is related to the following:Optics and PhotonicsServicesSearch for suppliers of: High Resolution Cameras | Cameras |

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