Providing 50% greater modulus/stiffness than standard neat PEEK grades, KetaSpire® KT-825 retains elongation and toughness that is comparable to that of neat PEEK resin for structural applications in transportation, electronics, semiconductor, and oil and gas. Dielectric strength per ASTM D149 at thickness of 3.2 mm is 26.0 kV/mm (660 V/mil) as compared with 15.2 kV/mm (385 V/mil) for neat PEEK. In addition, KT-825 meets UL’s V-0 flammability resistance requirements at thickness of 0.8 mm.
This story is related to the following:PEEK Resins |