Home High Temperature Adhesive suits applications to 2,300°F.
 

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High Temperature Adhesive suits applications to 2,300°F.

2014-06-09 14:32:14| Industrial Newsroom - All News for Today

Formulated for bonding and coating mica, glass-ceramics, and metals, Ceramabond™ 632 features dielectric strength of 150 V/mil at room temperature, coefficient of thermal expansion of 4.7 ppm/°F, and viscosity of 10,000–25,000 cp. Specific gravity is 1.45–1.50 g/cc and pH is 11.0. Applied using brush, syringe, or pneumatic dispenser, mica-filled adhesive sets rapidly at room temperature and step cures at 200°F and 500°F for 2 hours each. Cured material resists most acids, solvents, and fuels. This story is related to the following:Ceramic Adhesives | Adhesive Systems | Coating Adhesives

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