Home High Temperature Adhesive suits applications to 2,300°F.
 

Keywords :   


High Temperature Adhesive suits applications to 2,300°F.

2014-06-09 14:32:14| Industrial Newsroom - All News for Today

Formulated for bonding and coating mica, glass-ceramics, and metals, Ceramabond™ 632 features dielectric strength of 150 V/mil at room temperature, coefficient of thermal expansion of 4.7 ppm/°F, and viscosity of 10,000–25,000 cp. Specific gravity is 1.45–1.50 g/cc and pH is 11.0. Applied using brush, syringe, or pneumatic dispenser, mica-filled adhesive sets rapidly at room temperature and step cures at 200°F and 500°F for 2 hours each. Cured material resists most acids, solvents, and fuels. This story is related to the following:Ceramic Adhesives | Adhesive Systems | Coating Adhesives

Tags: high applications temperature suits

Category:Industrial Goods and Services

Latest from this category

All news

19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
23.11
23.11 85
23.11DANCEWITHDRAGON2 811
23.11 N5000VSE
23.11EZY POWER EDIT6
23.11RR4
23.1126.5 HG
23.11VISSLA
More »