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High Temperature Resistant, One Component Epoxy Cures at 200-220°F

2015-10-14 12:31:11| Industrial Newsroom - All News for Today

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature...

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Category:Industrial Goods and Services

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