je.st
news
High Temperature Resistant, One Component Epoxy Cures at 200-220°F
2015-10-14 12:31:11| Industrial Newsroom - All News for Today
Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature...
Tags: high
component
temperature
resistant
Category:Industrial Goods and Services
Latest from this category |
All news |
||||||||||||||||||||
|
|
||||||||||||||||||||