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Highly Precise and Fast Inspection of Solder and Sinter Pastes

2015-05-15 12:31:14| Industrial Newsroom - All News for Today

At the SMT/Hybrid/Packaging show in Nuremberg GOEPEL electronics will present a new generation solder paste inspection system. The SPI-Line 3D allows solder pastes and sinter pastes with a height of less than 50 m to be measured precisely and quickly. The newly developed measuring head, with double-sided projection...

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Category:Industrial Goods and Services

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