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IPC Conference to "Clean Up" Reliability Problems

2013-10-28 05:00:00| Industrial Newsroom - All News for Today

Although no-clean practices have altered printed board manufacturing processes, reliability expert Cheryl Tulkoff warns that, "Everyone should be thinking about cleaning and contamination issues." Tulkoff, of DfR Solutions, is among the experts who will address wide range of factors impacting reliability at IPC Conference on Solder and Reliability, Nov 13–14. Conference will also cover properties of solder alloys, defects like pad cratering, risk mitigation processes, and data ...This story is related to the following:Trade Associations

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