IPC released a global survey to collect data for the IPC International Technology Roadmap for Electronic Interconnections, and for IPC's 2014 Technology Trends Study. Survey covers key technical issues in both fabrication and assembly of PCBs, including clock speed, heat dissipation, layer counts, embedding, aspect ratios, I/O pitch, and component size. Respondents may answer questions that relate to their type of operations, focusing on specific end-use applications.
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